Publications

Journal

  1. C. Wang*, P.-C. Chiu*, C.-L. Ko, S.-H. Tseng, and C.-H. Li, “ A 340-GHz THz amplifier-frequency-multiplier chain with 360° phase-shifting range and its phase characterization,” IEEE J. Emerg. Sel. Topics Circuits Syst., vol. 14, no. 1, pp. 52-66, Mar. 2024. (*Co-first authors)
  2. Y. Wang, T.-Y. Chiu, T.-Y. Chiu, K.-J. Yu, Y.-M. Teng, G.-W. Huang, C.-H. Li, C.-N. Kuo, C.-C. Chiong, and H. Wang, “A Ka- to G-band detector with 5.5-GHz video bandwidth using a modified traveling-wave structure in 65-nm CMOS technology,” IEEE Trans. Circuits Syst. II, Exp. Briefs, vol. 70, no. 4, pp. 1371-1375, Apr. 2023.
  3. C.-H. Li and T.-Y. Chiu, “Low-loss single-band, dual-band, and broadband mm-wave and (sub-)THz interconnects for THz SoP heterogeneous system integration,” IEEE Trans. THz Sci. Technol., vol. 12, no. 2, pp. 130-143, Mar. 2022.
  4. T.-Y. Chiu and C.-H. Li, “340-GHz heterogeneously-integrated THz imager with 4°-beamwidth 16 × 16 IPD antenna array for lensless terahertz imaging applications,” IEEE Access, vol. 9, pp. 102195-102206, Jul. 2021.
  5. T.-Y. Chiu and C.-H. Li, “Low-loss low-cost substrate-integrated waveguide and filter in GaAs IPD technology for terahertz applications,” IEEE Access, vol. 9, pp. 86346-86357, Jun. 2021.
  6. C.-H. Li, K.-D. Huang, and T.-Y. Chiu, “A highly-integrated reconfigurable Ka-band receiver supporting active and passive detections in a 90-nm CMOS technology,” IEEE Access, vol. 9, pp. 38342-38351, Mar. 2021.
  7. C.-H. Li, W.-T. Hsieh, and T.-Y. Chiu, “A flip-chip-assembled W-band receiver in 90-nm and IPD technologies,” IEEE Trans. Microw. Theory Tech., vol. 67, no. 4, pp. 1628-1639, Apr. 2019.
  8. C.-H. Li and T.-Y. Chiu, “Single flip-chip-packaged dielectric resonator antenna for CMOS terahertz antenna array gain enhancement,” IEEE Access, vol. 7, pp. 7737-7746, 2019.
  9. C.-H. Li and W.-M. Wu, “A balun-less frequency multiplier with different output by current flow manipulation,” IEEE Trans. Very Large Scale Integr. VLSI Syst., vol. 26, no. 7, pp. 1391-1402, Jul. 2018.
  10. C.-H. Li, C.-L. Ko, M.-C. Kuo, and D.-C. Chang, “A 7.1-mW K/Ka-band mixer with configurable bondwire resonators in 65-nm CMOS,” IEEE Trans. Very Large Scale Integr. VLSI Syst., vol. 25, no. 9, pp. 2635-2648, Sep. 2017.
  11. C.-H. Li, M.-C. Yu, and H.-J. Lin, “A compact 0.9-/2.6-GHz dual-band RF energy harvester using SiP technique,” IEEE Microw. Wireless Compon. Lett., vol. 27, no. 7, pp. 666-668, Jul. 2017.
  12. C.-H. Li and T.-Y. Chiu, “340-GHz low-cost and high-gain on-chip higher order mode dielectric resonator antenna for THz applications,” IEEE Trans. THz Sci. Technol., vol. 7, no. 3, pp. 284-294, May 2017. (Popular document in IEEE Xplore)
  13. C.-L. Ko, C.-H. Li, M.-C. Kuo, and D.-C. Chang, “Constant loss contours of matching networks for millimeter-wave LNA design,” IEEE Microw. Wireless Compon. Lett., vol. 26, no. 11, pp. 939-941, Nov. 2016.
  14. C.-H. Li, C.-L. Ko, M.-C. Kuo, and D.-C. Chang, “A 340-GHz heterodyne receiver front-end in 40-nm CMOS for THz biomedical imaging applications,” IEEE Trans. THz Sci. Technol., vol. 6, no. 4, pp. 625-636, Jul. 2016. (Popular document in IEEE Xplore)
  15. C.-H. Li, T.-Y. Chao, C.-W. Lai, W.-C. Chen, C.-L. Ko, C.-N. Kuo, Y.-T. Cheng, Ming-Ching Kuo, and Da-Chiang Chang, “A 37.5-mW 8-dBm-EIRP 15.5°-HPBW 338-GHz THz transmitter using SoP heterogeneous system integration,” IEEE Trans. Microw. Theory Tech., vol. 63, no. 2, pp. 470-480, Feb. 2015.
  16. C.-H. Li, C.-L. Ko, C.-N. Kuo, M.-C. Kuo, and D.-C. Chang, “A 340-GHz triple-push oscillator with differential output in 40-nm CMOS,” IEEE Microw. Compon. Lett., vol. 24, no. 12, pp. 863-865, Dec. 2014.
  17. C.-H. Li, C.-L. Ko, C.-N. Kuo, M.-C. Kuo, and D.-C. Chang, “A low-cost DC-to-84-GHz broadband bondwire interconnect for SoP heterogeneous system integration,” IEEE Trans. Microw. Theory Tech., vol. 61, no. 12, pp. 4345-4352, Dec. 2013.
  18. C.-L. Ko, C.-H. Li, C.-N. Kuo, M.-C. Kuo, and D.-C. Chang, “A 210 GHz amplifier in 40 nm digital CMOS technology,” IEEE Trans. Microw. Theory Tech., vol. 61, no. 6, pp. 2438-2446, Jun. 2013.
  19. C.-H. Li, C.-N. Kuo, and M.-C. Kuo, “A 1.2-V 5.2-mW 20-30-GHz wideband receiver front-end in 0.18-μm CMOS,” IEEE Trans. Microw. Theory Tech., vol. 60, no. 11, pp. 3502-3512, Nov. 2012.
  20. C.-H. Li, Y.-L. Liu, and C.-N. Kuo, “The theory of resonator coupling network and its application to receiver front-end design,” International J. Electrical Engineering, vol. 19, no. 2, pp. 45-56, Apr. 2012.
  21. C.-H. Li, Y.-L. Liu, and C.-N. Kuo, “A 0.6-V 0.33-mW 5.5-GHz receiver front-end using resonator coupling technique,” IEEE Trans. Microw. Theory Tech., vol. 59, no. 6, pp. 1629-1638, Jun. 2011.
  22. T.-Y. Chao, C.-H. Li, Y. C. Chen, H.-Y. Chen, Y.-T. Cheng, and C.-N. Kuo, “An interconnecting technology for RF MEMS heterogeneous chip integration,” IEEE Trans. Electron Devices, vol. 57, no. 4, pp. 928-938, Apr. 2010.

 

Conference

  1. Y.-K. Chen, W.-Z. Su, Y.-F. Tseng, and C.-H. Li, “A 240-GHz wideband LNA with dual-peak-Gmax cores and customized high-speed transistors in 40-nm CMOS,” IEEE International Microwave Symposium, Washington, DC, U.S., Jun. 2024. (Accepted)
  2. C-H. Lin, C.-S. Lin, and C.-H. Li, “235-GHz amplifier-frequency-multiplier chain with optimal harmonic impedance matching network in 40-nm CMOS,” IEEE International Microwave Symposium, Washington, DC, U.S., Jun. 2024. (Accepted)
  3. C.-H. Li, W.-Z. Su, and Y.-K. Chen, “THz electronics for sensing and communication applications,” SPIE Optics + Photonics, 2023. (Invited)
  4. C. Wang, P.-C. Chiu, and C.-H. Li, “A W-band phase-shifter-embedded PA in 40-nm CMOS for 6G applications,” IEEE Int. Microwave Symp., 2023.
  5. C.-H. Li and T.-Y. Chiu, “A compact and low-cost THz SoP heterogeneous integration platform,” in IEEE Int. Symp. Radio-Frequency Integration Technology, 2022. (Invited)
  6. T.-Y. Chiu and C.-H. Li, “A low-power 340-GHz receiver in 40-nm CMOS for THz imaging applications,” in IEEE Int. Symp. Radio-Frequency Integration Technology, 2021.
  7. C. Wang and C.-H. Li, “A G-band frequency doubler in 40-nm digital CMOS for THz applications,” in IEEE Int. Symp. Radio-Frequency Integration Technology, 2021.
  8. T.-Y. Chiu, Y.-L. Lee, C.-L. Ko, S.-H. Tseng, and C.-H. Li, “A low-loss balun-embedded interconnect for THz heterogeneous system integration,” IEEE Int. Microwave Symp., 2020.
  9. C. Wang, K.-Y. Chen, Y.-L. Lee, and C.-H. Li, “A X-/Ku-band QFN-packaged GaAs LNA supporting dual-polarization signal reception,” Asia-Pacific Microw. Conf. (APMC), 2019.
  10. C.-H. Li and T.-Y. Chiu, “CMOS devices and circuits for THz applications,” Asia-Pacific Microw. Conf. (APMC), 2018. (Distinguished Invited Speaker)
  11. Y.-L. Su, C.-C. Jian, Y.-L. Lee, C.-H. Li, and T. Lohrey, “Dichroic sub-reflector for wide band technique for single offset antenna,” EuMC, 2018.
  12. M.-T. Hsu, T.-Y. Chiu, S.-Y. Wu, Y.-T. Cheng, C.-H. Li, and C.-N. Kuo, “A silicon-based parabolic sub-reflector antenna for gain enhancement and near-field focus applications,” IEEE Int. Conf. Micro Electro Mechanical Syst., 2018.
  13. Y.-W. Chang, M.-C. Yu, H.-J. Lin, and C.-H. Li, “Compact low-cost five-band RF energy harvester using system-in-packaging integration,” IEEE Radio Wireless Symposium, 2018. (Finalist of Best Student Paper)
  14. T.-Y. Chiu, C. Wang, W.-T. Hsieh, H.-J. Lin, T.-Y. Lin, R. Liu, D.-C. Chang, and C.-H. Li, “A 340-GHz high-gain flip-chip packaged dielectric resonator antenna for THz imaging applications,” in IEEE Int. Symp. Radio-Frequency Integration Technology, 2017. (Finalist of Best Student Paper)
  15. C.-N. Kuo, W.-C. Chen, T.-Y. Chiu, and C.-H. Li, “Enhancement of THz imaging sensing by packaging technology,” in IEEE Int. Symp. Radio-Frequency Integration Technology, 2017. (Invited)
  16. Y.-X. Lu, M.-T. Hsu, Y.-T. Cheng, C.-H. Li, and C.-N. Kuo, “Focused source formation using a micro disc-like patch antenna array for THz CMOS transmitter applications,” Transducers, 2017.
  17. M.-C. Yu and C.-H. Li, “High-sensitivity and high-efficiency 2.4-GHz RF energy harvester using SiP technique,” URSI Asia-Pacific Radio Science Conference, 2016.
  18. C.-H. Li, T.-C. Yan, Y. Chang, C. Chen, and C.-N. Kuo, “Low-cost high-performance CMOS THz imaging system,” 12th Int. SOC Design Conference, 2015. (Invited)
  19. W.-M. Wu, M.-C. Yu, C.-H. Li, and C.-N. Kuo, “A low-cost DC-to-92 GHz broadband three-path bondwire interconnect,” in IEEE Int. Symp. Radio-Frequency Integration Technology, 2015.
  20. C.-H. Li, C.-W. Lai, T.-C. Yan, and C.-N. Kuo, “A low-cost broadband bondwire interconnect for THz heterogeneous system integration,” in Proc. IEEE Int. Microwave Symp., 2015.
  21. C.-L. Ko, C.-H. Li, C.-N. Kuo, M.-C. Kuo, and D.-C. Chang, “A 8-mW 77-GHz band CMOS LNA by using reduced simultaneous noise and impedance matching technique,” IEEE Int. Symp. Circuits Systems, 2015.
  22. W.-C. Chen, C.-W. Lai, T.-C. Yan, C.-H. Li, T.-Y. Chao, and C.-N. Kuo, “Electronic THz transmissive imaging systems,” IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, 2015.
  23. T.-C. Yan, C.-H. Li, C.-W. Lai, W.-C. Chen, T.-Y. Chao, and C.-N. Kuo, “CMOS THz transmissive imaging systems,” IEEE Asian Solid-State Circuits Conf., 2014.
  24. C.-W. Lai, W.-C. Chen, T.-C. Yan, C.-H. Li, and C.-N. Kuo, “The experimental study of THz image sensor in 0.18 μm CMOS technology,” Asia-Pacific Microw. Conf., 2014.
  25. C.-W. Lai, W.-C. Chen, T.-C. Yan, C.-H. Li, M.-C. Kuo, and C.-N. Kuo, “The experimental study of THz power detector design in 0.18-μm CMOS technology,” Progress in Electromagnetics Research Symposium, 2014.
  26. C.-H. Li, C.-W. Lai, and C.-N. Kuo, “A 147 GHz fully differential D-band amplifier design in 65 nm CMOS,” Asia-Pacific Microw. Conf., 2013, pp. 691-693.
  27. C.-H. Li, J.-J. Wu, C.-N. Kuo, Y.-T. Cheng, and M.-C. Kuo, “A broadband interconnect for THz heterogeneous system integration,” IEEE Int. Microwave Symp., 2013, pp. 1-4.
  28. C.-H. Li, C.-L. Ko, C.-N. Kuo, M.-C. Kuo, and D.-C. Chang, “A low-cost broadband bondwire interconnect for heterogeneous system integration,” IEEE Int. Microwave Symp., 2013, pp. 1-4.
  29. C.-H. Li, C.-N. Kuo, and M.-C. Kuo, “A high Q on-chip bondwire transformer and its application to low power receiver front-end design,” IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, 2013, pp. 120-122.
  30. C.-H. Li and C.-N. Kuo, “16.9-mW 33.7-dB gain mmWave receiver front-end in 65 nm CMOS,” IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, 2012, pp. 179-182.
  31. C.-H. Li, C.-Y. Hsu, and C.-N. Kuo, “Low power 2.4 GHz receiver front-end using resonator coupling technique,” 54 th IEEE Int. Midwest Symp. Circuits Syst., 2011, pp.1-4. (Invited)
  32. C.-H. Li and C.-N. Kuo, “Design optimization of a 1.4 GHz low power bulk-driven mixer,” Asia-Pacific Microw. Conf., 2010, pp. 1035-1038.
  33. Y.-L. Liu, C.-H. Li, and C.-N. Kuo, “Low voltage low power 5-GHz doubled balanced mixer with active phase shifter,” Asia-Pacific Microw. Conf., 2010, pp. 550-553.
  34. C.-H. Li, C. T. Fu, T.-Y. Chao, C.-N. Kuo, Y.-T. Cheng, and D.-C. Chang, “Broadband flip-chip interconnects for millimeter-wave Si-carrier system-on-package,” IEEE Int. Microwave Symp., 2007, pp. 1645-1648.
  35. Y. C. Chen, C.-H. Li, J. K. Huang, C.-N. Kuo, and Y.-T. Cheng, “Low power 3~8 GHz UWB tunable LNA design using SiP technology,” IEEE Int. Conf. Electronics Circuits Syst., 2006, pp. 1026-1029. (Best Paper Award)

 

Invited Talks

  1. THz Electronics for Sensing and Communication Applications, ACE Workshop on LEO and High-Frequency Material Measurement, ACE. Solution, Hsinchu, Taiwan, Dec. 2023.
  2. THz Electronics for Sensing and Communication Applications, Rising Star Express Forum, IEEE Asian Solid-State Circuits Conference, Hainan, China, Nov. 2023.
  3. THz Electronics for Sensing and Communication Applications, Seminar, Department of Electrophysics, National Yang Ming Chiao Tung University, Hsinchu, Taiwan, Oct. 2023.
  4. THz Electronics for Sensing and Communication Applications, SPIE Optics + Photonics, San Diego, CA, U.S., Aug. 2023.
  5. THz Electronics for Sensing and Communication Applications, The 3rd Symposium on Nano-Device Circuits and Technologies (SNDCT), Hsinchu, Taiwan, May 2023.
  6. THz Electronics for Sensing and Communication Applications, Spring Workshop, Graduate School of Advanced Technology, National Taiwan University, Taipei, Taiwan, Mar. 2023.
  7. THz Electronics for Sensing and Communication Applications, Seminar, Institute of Electronics Engineering, National Tsing Hua University, Hsinchu, Taiwan, Dec. 2022.
  8. Sub-THz/THz Transceiver Architectures for Next-Generation Communication Applications, NTU SoC Workshop on LEO Critical Components and Techniques, NTU SoC Center, Taipei, Taiwan, Nov. 2022.
  9. THz Electronics for Sensing Applications Seminar, Graduate Institute of Electronics Engineering, National Taiwan University, Taipei, Taiwan, Oct. 2022.
  10. THz Electronics for 6G Communication Applications, ICS Seminar, Graduate Institute of Electronics Engineering, National Taiwan University, Taipei, Taiwan, Sep. 2022.
  11. THz Electronics for 6G Communication Applications, TAICS Standards Forum, Taiwan Association of Information and Communication Standards, Taiwan, May 2022. (Virtual)
  12. THz Electronics for Sensing and Communication Applications, IEEE CASIF in 6G Circuits and Systems, Taipei Chapter, IEEE CASS, Dec. 2021.
  13. Tera/millimeter-wave Radar Technologies, RichWave Technology Forum, Taipei, Taiwan, Dec. 2021.
  14. THz Electronics for Sensing and Communication Applications, Seminar, Department of Electrical Engineering, National Taiwan Normal University, Taipei, Taiwan, Oct. 2021.
  15. THz Electronics for Sensing and Communication Applications, Seminar, Department of Electrical Engineering, National Yang Ming Chiao Tung University, Hsinchu, Taiwan, Mar. 2021.
  16. THz Electronics for Sensing and Communication Applications, TICD Seminar, Taiwan IC Design Society, Hsinchu, Taiwan, Mar. 2021.
  17. THz Electronics for Sensing and Communication Applications, Taiwan Telecommunication Annual Symposium, Taipei, Taiwan, Jan. 2021. (Keynote speech)
  18. THz Electronics for Security and Biomedical Applications, NTU SoC Workshop on Precision Health Technologies, NTU SoC Center, Taipei, Taiwan, Dec. 2020.
  19. CMOS Devices, Circuits, and Radars for THz Imaging Applications, Seminar, Department of Electrical Engineering, National Tsing Hua University, Hsinchu, Taiwan, Sep. 2020.
  20. CMOS devices and circuits for THz applications, THz Workshop, National Tsing Hua University, Hsinchu, Taiwan, May 2019.
  21. CMOS devices and circuits for THz applications, Seminar, Department of Engineering and System Science, National Tsing Hua University, Hsinchu, Taiwan, Dec. 2018.
  22. CMOS devices and circuits for THz applications, Asia Pacific Microwave Conference, Kyoto, Japan, Nov. 2018 (Distinguished Invited Speaker)
  23. CMOS THz Transmissive Imaging System, Seminar, Department of Electrical Engineering, National Tsing Hua University, Nov. 2016.
  24. CMOS THz Imaging System, Seminar, Department of Communications Engineering, Yuan-Ze University, Nov. 2014.
  25. CMOS THz Imaging System, Seminar, Department of Electrical Engineering, National Central University, Sep. 2014
  26. Toward Low-Cost and High-Performance THz Systems: An SoP Heterogeneous Integration Approach, Seminar, Department of Electrical Engineering, National Central University, Nov. 2013.

Patents Awarded

  1. 李俊興、邱品鈞，應用於無線系統的可延展相位陣列系統，中華民國專利，I799197。 (R.O.C. patent, Apr. 2023)
  2. C.-H. Li, C.-N. Kuo, and C.-L. Ko, “Interconnecting structure for electrically connecting a first electronic device and a second electronic device,” U.S. patent no. US9577308B2, Feb. 2017.
  3. C.-H. Li and C.-N. Kuo, “Broadband connection structure and method,” U.S. patent no. US9450650B2, Sep. 2016.
  4. 李俊興、郭建男，寬頻連接結構及其連接方法、傳輸裝置及傳輸寬頻訊號的方法，中華民國專利，I532351。 (R.O.C. patent, May 2016)
  5. 李俊興、郭建男、柯鈞琳，一種連接結構及其使用方法，中華民國專利，I511252。 (R.O.C. patent, Dec. 2015)

Patent Pending

  1. C.-H. Li and P.-C. Chiu, “Scalable phased-array system for wireless systems,” U.S. patent application no.: 17/697918.