Publications

Journal

  1. Chun-Hsing Li and Te-Yen Chiu, “Low-loss Single-Band, Dual-Band, and Broadband mm-Wave and (Sub-)THz Interconnects for THz SoP Heterogeneous System Integration,” IEEE Trans. THz Sci. Technol., 2021. (Accepted)
  2. Te-Yen Chiu and Chun-Hsing Li, “340-GHz Heterogeneously-Integrated THz Imager with 4°-Beamwidth 16 × 16 IPD Antenna Array for Lensless Terahertz Imaging Applications,” IEEE Access, vol. 9, pp. 102195-102206, Jul. 2021.
  3. Te-Yen Chiu and Chun-Hsing Li, “Low-loss low-cost substrate-integrated waveguide and filter in GaAs IPD technology for terahertz applications,” IEEE Access, vol. 9, pp. 86346-86357, Jun. 2021.
  4. Chun-Hsing Li, Ke-Deng Huang, and Te-Yen Chiu, “A highly-integrated reconfigurable Ka-band receiver supporting active and passive detections in a 90-nm CMOS technology,” IEEE Access, vol. 9, pp. 38342-38351, Mar. 2021.
  5. Chun-Hsing Li, Wan-Ting Hsieh, and Te-Yen Chiu, “A flip-chip-assembled W-band receiver in 90-nm and IPD technologies,” IEEE Trans. Microw. Theory Tech., vol. 67, no. 4, pp. 1628-1639, Apr. 2019.
  6. Chun-Hsing Li and Te-Yen Chiu, “Single flip-chip-packaged dielectric resonator antenna for CMOS terahertz antenna array gain enhancement,” IEEE Access, vol. 7, pp. 7737-7746, 2019.
  7. Chun-Hsing Li and Wei-Min Wu, “A balun-less frequency multiplier with different output by current flow manipulation,” IEEE Trans. Very Large Scale Integr. VLSI Syst., vol. 26, no. 7, pp. 1391-1402, Jul. 2018.
  8. Chun-Hsing Li, Chun-Lin Ko, Ming-Ching Kuo, and Da-Chiang Chang, “A 7.1-mW K/Ka-band mixer with configurable bondwire resonators in 65-nm CMOS,” IEEE Trans. Very Large Scale Integr. VLSI Syst., vol. 25, no. 9, pp. 2635-2648, Sep. 2017.
  9. Chun-Hsing Li, Ming-Che Yu, and Hsien-Jia Lin, “A compact 0.9-/2.6-GHz dual-band RF energy harvester using SiP technique,” IEEE Microw. Wireless Compon. Lett., vol. 27, no. 7, pp. 666-668, Jul. 2017.
  10. Chun-Hsing Li and Te-Yen Chiu, “340-GHz low-cost and high-gain on-chip higher order mode dielectric resonator antenna for THz applications,” IEEE Trans. THz Sci. Technol., vol. 7, no. 3, pp. 284-294, May 2017. (Popular document in IEEE Xplore)
  11. Chun-Lin Ko, Chun-Hsing Li, Chien-Nan Kuo, Ming-Ching Kuo, and Da-Chiang Chang, “Constant loss contours of matching networks for millimeter-wave LNA design,” IEEE Microw. Wireless Compon. Lett., vol. 26, no. 11, pp. 939-941, Nov. 2016.
  12. Chun-Hsing Li, Chun-Lin Ko, Ming-Ching Kuo, and Da-Chiang Chang, “A 340-GHz heterodyne receiver front-end in 40-nm CMOS for THz biomedical imaging applications,” IEEE Trans. THz Sci. Technol., vol. 6, no. 4, pp. 625-636, Jul. 2016. (Popular document in IEEE Xplore)
  13. Chun-Hsing Li, Tzu-Yuan Chao, Chih-Wei Lai, Wei-Cheng Chen, Chun-Lin Ko, Chien-Nan Kuo, Yu-Ting Cheng, Ming-Ching Kuo, and Da-Chiang Chang, “A 37.5-mW 8-dBm-EIRP 15.5°-HPBW 338-GHz THz transmitter using SoP heterogeneous system integration,” IEEE Trans. Microw. Theory Tech., vol. 63, no. 2, pp. 470-480, Feb. 2015.
  14. Chun-Hsing Li, Chun-Lin Ko, Chien-Nan Kuo, Ming-Ching Kuo, and Da-Chiang Chang, “A 340-GHz triple-push oscillator with differential output in 40-nm CMOS,” IEEE Microw. Compon. Lett., vol. 24, no. 12, pp. 863-865, Dec. 2014.
  15. Chun-Hsing Li, Chun-Lin Ko, Chien-Nan Kuo, Ming-Ching Kuo, and Da-Chiang Chang, “A low-cost DC-to-84-GHz broadband bondwire interconnect for SoP heterogeneous system integration,” IEEE Trans. Microw. Theory Tech., vol. 61, no. 12, pp. 4345-4352, Dec. 2013.
  16. Chun-Lin Ko, Chun-Hsing Li, Chien-Nan Kuo, Ming-Ching Kuo, and Da-Chiang Chang, “A 210 GHz amplifier in 40 nm digital CMOS technology,” IEEE Trans. Microw. Theory Tech., vol. 61, no. 6, pp. 2438-2446, Jun. 2013.
  17. Chun-Hsing Li, Chien-Nan Kuo, and Ming-Ching Kuo, “A 1.2-V 5.2-mW 20-30-GHz wideband receiver front-end in 0.18-μm CMOS,” IEEE Trans. Microw. Theory Tech., vol. 60, no. 11, pp. 3502-3512, Nov. 2012.
  18. Chun-Hsing Li, Yen-Lin Liu, and Chien-Nan Kuo, “The theory of resonator coupling network and its application to receiver front-end design,” International J. Electrical Engineering, vol. 19, no. 2, pp. 45-56, Apr. 2012.
  19. Chun-Hsing Li, Yen-Lin Liu, and Chien-Nan Kuo, “A 0.6-V 0.33-mW 5.5-GHz receiver front-end using resonator coupling technique,” IEEE Trans. Microw. Theory Tech., vol. 59, no. 6, pp. 1629-1638, Jun. 2011.
  20. Tzu-Yuan Chao, Chun-Hsing Li, Yang Chuan Chen, Hsin-Yu Chen, Yu-Ting. Cheng, and Chien-Nan Kuo, “An interconnecting technology for RF MEMS heterogeneous chip integration,” IEEE Trans. Electron Devices, vol. 57, no. 4, pp. 928-938, Apr. 2010.

 

Conference

  1. Te-Yen Chiu and Chun-Hsing Li, “A low-power 340-GHz receiver in 40-nm CMOS for THz imaging applications,” in IEEE Int. Symp. Radio-Frequency Integration Technology, 2021.
  2. Chun Wang and Chun-Hsing Li, “A G-band frequency doubler in 40-nm digital CMOS for THz applications,” in IEEE Int. Symp. Radio-Frequency Integration Technology, 2021.
  3. Te-Yen Chiu, Yu-Ling Lee, Chun-Lin Ko, Sheng-Hsiang Tseng, and Chun-Hsing Li, “A low-loss balun-embedded interconnect for THz heterogeneous system integration,” IEEE Int. Microwave Symp., 2020.
  4. Chun Wang, Kuang-Yu Chen, Yu-Ling Lee, and Chun-Hsing Li, “A X-/Ku-band QFN-packaged GaAs LNA supporting dual-polarization signal reception,” Asia-Pacific Microw. Conf. (APMC), 2019.
  5. Chun-Hsing Li and Te-Yen Chiu, “CMOS devices and circuits for THz applications,” Asia-Pacific Microw. Conf. (APMC), 2018. (Distinguished Invited Speaker)
  6. Yu-Lun Su, Chung-Chin Jian, Yu-Ling Lee, Chun-Hsing Li, and Thomas Lohrey, “Dichroic sub-reflector for wide band technique for single offset antenna,” EuMC, 2018.
  7. Chun-Hsing Li and Te-Yen Chiu, “A 340-GHz 2×2 CMOS THz imaging array sensor with high-resistivity silicon superstrate,” 6th Int. Sensors Science (I3S), 2018.
  8. Meng-Tse Hsu, Te-Yen Chiu, Syuan-Yu Wu, Yu-Ting Cheng, Chun-Hsing Li, and Chien-Nan Kuo, “A silicon-based parabolic sub-reflector antenna for gain enhancement and near-field focus applications,” IEEE Int. Conf. Micro Electro Mechanical Syst., 2018.
  9. Yen-Wei Chang, Ming-Che Yu, Hsien-Jia Lin, and Chun-Hsing Li, “Compact low-cost five-band RF energy harvester using system-in-packaging integration,” IEEE Radio Wireless Symposium, 2018. (Finalist of Best Student Paper)
  10. Te-Yen Chiu and Chun-Hsing Li, “A 340-GHz high-gain silicon dielectric resonator antenna for THz imaging applications,” The 28th VLSI/CAD Symposium, 2017. (Finalist of Best Student Paper)
  11. Te-Yen Chiu, Chun Wang, Wan-Ting Hsieh, Hsien-Jia Lin, Ta-Yeh Lin, Roger Liu, Da-Chiang Chang, and Chun-Hsing Li, “A 340-GHz high-gain flip-chip packaged dielectric resonator antenna for THz imaging applications,” in IEEE Int. Symp. Radio-Frequency Integration Technology, 2017. (Finalist of Best Student Paper)
  12. Chien-Nan Kuo, Wei-Cheng Chen, Te-Yen Chiu, and Chun-Hsing Li, “Enhancement of THz imaging sensing by packaging technology,” in IEEE Int. Symp. Radio-Frequency Integration Technology, 2017. (Invited)
  13. Yi-Xuan Lu, Meng-Tse Hsu, Yu-Ting Cheng, Chun-Hsing Li, and Chien-Nan Kuo, “Focused source formation using a micro disc-like patch antenna array for THz CMOS transmitter applications,” Transducers, 2017.
  14. Ming-Che Yu and Chun-Hsing Li, “High-sensitivity and high-efficiency 2.4-GHz RF energy harvester using SiP technique,” URSI Asia-Pacific Radio Science Conference, 2016.
  15. Te-Yen Chiu, Chun-Lin Ko, Chun-Hsing Li, Ming-Ching Kuo, and Da-Chiang Chang, “340-GHz signal source design with integrated on-chip bondwire antenna in 40-nm CMOS,” Int. Conf. Electronics Engineering Informatics, 2016.
  16. Chun-Hsing Li, Tzu-Chao Yan, Yuhsin Chang, Chyong Chen, and Chien-Nan Kuo, “Low-cost high-performance CMOS THz imaging system,” 12th Int. SOC Design Conference, 2015. (Invited)
  17. Wei-Min Wu, Ming-Che Yu, Chun-Hsing Li, and Chien-Nan Kuo, “A low-cost DC-to-92 GHz broadband three-path bondwire interconnect,” in IEEE Int. Symp. Radio-Frequency Integration Technology, 2015.
  18. Chun-Hsing Li, Chih-Wei Lai, Tzu-Chao Yan, and Chien-Nan Kuo, “A low-cost broadband bondwire interconnect for THz heterogeneous system integration,” in Proc. IEEE Int. Microwave Symp., 2015.
  19. Chun-Lin Ko, Chun-Hsing Li, Chien-Nan Kuo, Ming-Ching Kuo, and Da-Chiang Chang, “A 8-mW 77-GHz band CMOS LNA by using reduced simultaneous noise and impedance matching technique,” IEEE Int. Symp. Circuits Systems, 2015.
  20. Wei-Cheng Chen, Chih-Wei Lai, Tzu-Chao Yan, Chun-Hsing Li, Tzu-Yuan Chao, and Chien-Nan Kuo, “Electronic THz transmissive imaging systems,” IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, 2015.
  21. Tzu-Chao Yan, Chun-Hsing Li, Chih-Wei Lai, Wei-Cheng Chen, Tzu-Yuan Chao, and Chien-Nan Kuo, “CMOS THz transmissive imaging systems,” IEEE Asian Solid-State Circuits Conf., 2014.
  22. Chih-Wei Lai, Wei-Cheng Chen, Tzu-Chao Yan, Chun-Hsing Li, and Chien-Nan Kuo, “The experimental study of THz image sensor in 0.18 μm CMOS technology,” Asia-Pacific Microw. Conf., 2014.
  23. Tzu-Chao Yan, Chun-Hsing Li, Chih-Wei Lai, Wei-Cheng Chen, Tzu-Yuan Chao, and Chien-Nan Kuo, “THz imaging systems in CMOS technology,” The 25th VLSI/CAD Symposium, Aug. 2014.
  24. Chih-Wei Lai, Wei-Cheng Chen, Tzu-Chao Yan, Chun-Hsing Li, Ming-Ching Kuo, and Chien-Nan Kuo, “The experimental study of THz power detector design in 0.18-μm CMOS technology,” Progress in Electromagnetics Research Symposium, 2014.
  25. Chun-Hsing Li, Chih-Wei Lai, and Chien-Nan Kuo, “A 147 GHz fully differential D-band amplifier design in 65 nm CMOS,” Asia-Pacific Microw. Conf., 2013, pp. 691-693.
  26. Chun-Hsing Li, Jan-Jr Wu, Chien-Nan Kuo, Yu-Ting Cheng, and Ming-Ching Kuo, “A broadband interconnect for THz heterogeneous system integration,” IEEE Int. Microwave Symp., 2013, pp. 1-4.
  27. Chun-Hsing Li, Chun-Lin Ko, Chien-Nan Kuo, Ming-Ching Kuo, and Da-Chiang Chang, “A low-cost broadband bondwire interconnect for heterogeneous system integration,” IEEE Int. Microwave Symp., 2013, pp. 1-4.
  28. Chun-Hsing Li, Chien-Nan Kuo, and Ming-Ching Kuo, “A high Q on-chip bondwire transformer and its application to low power receiver front-end design,” IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, 2013, pp. 120-122.
  29. Chun-Hsing Li and Chien-Nan Kuo, “16.9-mW 33.7-dB gain mmWave receiver front-end in 65 nm CMOS,” IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, 2012, pp. 179-182.
  30. Chun-Hsing Li, Yen-Lin Liu, and Chien-Nan Kuo, “Theory of resonator coupling network and its application to receiver front-end design,” The 22th VLSI/CAD Symposium, Taiwan, Aug. 2011.
  31. Chun-Hsing Li, Chia-Yu Hsu, and Chien-Nan Kuo, “Low power 2.4 GHz receiver front-end using resonator coupling technique,” 54 th IEEE Int. Midwest Symp. Circuits Syst., 2011, pp.1-4. (Invited)
  32. Chun-Hsing Li and Chien-Nan Kuo, “Design optimization of a 1.4 GHz low power bulk-driven mixer,” Asia-Pacific Microw. Conf., 2010, pp. 1035-1038.
  33. Yen-Lin Liu, Chun-Hsing Li, and Chien-Nan Kuo, “Low voltage low power 5-GHz doubled balanced mixer with active phase shifter,” Asia-Pacific Microw. Conf., 2010, pp. 550-553.
  34. Chun-Hsing Li, Chang Tsung Fu, Tzu-Yuan Chao, Chien-Nan Kuo, Yu-Ting Cheng, and D.-C. Chang, “Broadband flip-chip interconnects for millimeter-wave Si-carrier system-on-package,” IEEE Int. Microwave Symp., 2007, pp. 1645-1648.
  35. Yang Chuan Chen, Chun-Hsing Li, J. K. Huang, Chien-Nan Kuo, and Yu-Ting Cheng, “Low power 3~8 GHz UWB tunable LNA design using SiP technology,” IEEE Int. Conf. Electronics Circuits Syst., 2006, pp. 1026-1029. (Best Paper Award)

 

Invited Talks

  1. Chun-Hsing Li, “CMOS Devices and Circuits for THz Applications,” Terahertz Workshop, NTHU, 2019.
  2. Chun-Hsing Li, “Wireless Applications,” Dept. Engineering and System Science, NTHU, 2018.
  3. Chun-Hsing Li, “CMOS Devices and Circuits for THz Applications,” Dept. Engineering and System Science, NTHU, 2018.
  4. Chun-Hsing Li, “CMOS THz transmissive imaging systems,” Dept. Electrical Engineering, NTHU, 2016.
  5. Chun-Hsing Li, “CMOS THz imaging system,” Dept. Electrical and Computer Engineering, NCTU, 2016.
  6. Chun-Hsing Li, “CMOS THz imaging system,” Dept. Communications Engineering, Yuan-Ze University, 2014.
  7. Chun-Hsing Li, “Toward low-cost and high-performance THz systems: An SoP heterogeneous integration approach,” Dept. Electrical Engineering, NCU, 2013.
  8. Chun-Hsing Li, “CMOS THz imaging system,” Dept. Electrical Engineering, NCU, 2014.

 

Patents Awarded

  1. 李俊興,郭建男,柯鈞琳,一種連接結構及其使用方法,中華民國專利,I511252。 (R.O.C. patent)
  2. 李俊興,郭建男,寬頻連接結構及其連接方法、傳輸裝置及傳輸寬頻訊號的方法,中華民國專利,I532351。 (R.O.C. patent)
  3. Chun-Hsing Li, Chien-Nan Kuo, and Chun-Lin Ko, “Interconnecting structure for electrically connecting a first electronic device and a second electronic device,” US9577308.
  4. Chun-Hsing Li and Chien-Nan Kuo, “Broadband connection structure and method,” US9450650.