Publications

Journal

  1. Chun-Hsing Li and Te-Yen Chiu, “Low-loss single-band, dual-band, and broadband mm-wave and (sub-)THz interconnects for THz SoP heterogeneous system integration,” IEEE Trans. THz Sci. Technol., vol. 12, no. 2, pp. 130-143, Mar. 2022.
  2. Te-Yen Chiu and Chun-Hsing Li, “340-GHz heterogeneously-integrated THz imager with 4°-beamwidth 16 × 16 IPD antenna array for lensless terahertz imaging applications,” IEEE Access, vol. 9, pp. 102195-102206, Jul. 2021.
  3. Te-Yen Chiu and Chun-Hsing Li, “Low-loss low-cost substrate-integrated waveguide and filter in GaAs IPD technology for terahertz applications,” IEEE Access, vol. 9, pp. 86346-86357, Jun. 2021.
  4. Chun-Hsing Li, Ke-Deng Huang, and Te-Yen Chiu, “A highly-integrated reconfigurable Ka-band receiver supporting active and passive detections in a 90-nm CMOS technology,” IEEE Access, vol. 9, pp. 38342-38351, Mar. 2021.
  5. Chun-Hsing Li, Wan-Ting Hsieh, and Te-Yen Chiu, “A flip-chip-assembled W-band receiver in 90-nm and IPD technologies,” IEEE Trans. Microw. Theory Tech., vol. 67, no. 4, pp. 1628-1639, Apr. 2019.
  6. Chun-Hsing Li and Te-Yen Chiu, “Single flip-chip-packaged dielectric resonator antenna for CMOS terahertz antenna array gain enhancement,” IEEE Access, vol. 7, pp. 7737-7746, 2019.
  7. Chun-Hsing Li and Wei-Min Wu, “A balun-less frequency multiplier with different output by current flow manipulation,” IEEE Trans. Very Large Scale Integr. VLSI Syst., vol. 26, no. 7, pp. 1391-1402, Jul. 2018.
  8. Chun-Hsing Li, Chun-Lin Ko, Ming-Ching Kuo, and Da-Chiang Chang, “A 7.1-mW K/Ka-band mixer with configurable bondwire resonators in 65-nm CMOS,” IEEE Trans. Very Large Scale Integr. VLSI Syst., vol. 25, no. 9, pp. 2635-2648, Sep. 2017.
  9. Chun-Hsing Li, Ming-Che Yu, and Hsien-Jia Lin, “A compact 0.9-/2.6-GHz dual-band RF energy harvester using SiP technique,” IEEE Microw. Wireless Compon. Lett., vol. 27, no. 7, pp. 666-668, Jul. 2017.
  10. Chun-Hsing Li and Te-Yen Chiu, “340-GHz low-cost and high-gain on-chip higher order mode dielectric resonator antenna for THz applications,” IEEE Trans. THz Sci. Technol., vol. 7, no. 3, pp. 284-294, May 2017. (Popular document in IEEE Xplore)
  11. Chun-Lin Ko, Chun-Hsing Li, Chien-Nan Kuo, Ming-Ching Kuo, and Da-Chiang Chang, “Constant loss contours of matching networks for millimeter-wave LNA design,” IEEE Microw. Wireless Compon. Lett., vol. 26, no. 11, pp. 939-941, Nov. 2016.
  12. Chun-Hsing Li, Chun-Lin Ko, Ming-Ching Kuo, and Da-Chiang Chang, “A 340-GHz heterodyne receiver front-end in 40-nm CMOS for THz biomedical imaging applications,” IEEE Trans. THz Sci. Technol., vol. 6, no. 4, pp. 625-636, Jul. 2016. (Popular document in IEEE Xplore)
  13. Chun-Hsing Li, Tzu-Yuan Chao, Chih-Wei Lai, Wei-Cheng Chen, Chun-Lin Ko, Chien-Nan Kuo, Yu-Ting Cheng, Ming-Ching Kuo, and Da-Chiang Chang, “A 37.5-mW 8-dBm-EIRP 15.5°-HPBW 338-GHz THz transmitter using SoP heterogeneous system integration,” IEEE Trans. Microw. Theory Tech., vol. 63, no. 2, pp. 470-480, Feb. 2015.
  14. Chun-Hsing Li, Chun-Lin Ko, Chien-Nan Kuo, Ming-Ching Kuo, and Da-Chiang Chang, “A 340-GHz triple-push oscillator with differential output in 40-nm CMOS,” IEEE Microw. Compon. Lett., vol. 24, no. 12, pp. 863-865, Dec. 2014.
  15. Chun-Hsing Li, Chun-Lin Ko, Chien-Nan Kuo, Ming-Ching Kuo, and Da-Chiang Chang, “A low-cost DC-to-84-GHz broadband bondwire interconnect for SoP heterogeneous system integration,” IEEE Trans. Microw. Theory Tech., vol. 61, no. 12, pp. 4345-4352, Dec. 2013.
  16. Chun-Lin Ko, Chun-Hsing Li, Chien-Nan Kuo, Ming-Ching Kuo, and Da-Chiang Chang, “A 210 GHz amplifier in 40 nm digital CMOS technology,” IEEE Trans. Microw. Theory Tech., vol. 61, no. 6, pp. 2438-2446, Jun. 2013.
  17. Chun-Hsing Li, Chien-Nan Kuo, and Ming-Ching Kuo, “A 1.2-V 5.2-mW 20-30-GHz wideband receiver front-end in 0.18-μm CMOS,” IEEE Trans. Microw. Theory Tech., vol. 60, no. 11, pp. 3502-3512, Nov. 2012.
  18. Chun-Hsing Li, Yen-Lin Liu, and Chien-Nan Kuo, “The theory of resonator coupling network and its application to receiver front-end design,” International J. Electrical Engineering, vol. 19, no. 2, pp. 45-56, Apr. 2012.
  19. Chun-Hsing Li, Yen-Lin Liu, and Chien-Nan Kuo, “A 0.6-V 0.33-mW 5.5-GHz receiver front-end using resonator coupling technique,” IEEE Trans. Microw. Theory Tech., vol. 59, no. 6, pp. 1629-1638, Jun. 2011.
  20. Tzu-Yuan Chao, Chun-Hsing Li, Yang Chuan Chen, Hsin-Yu Chen, Yu-Ting. Cheng, and Chien-Nan Kuo, “An interconnecting technology for RF MEMS heterogeneous chip integration,” IEEE Trans. Electron Devices, vol. 57, no. 4, pp. 928-938, Apr. 2010.

 

Conference

  1. Chun-Hsing Li and Te-Yen Chiu, “A compact and low-cost THz SoP heterogeneous integration platform,” in IEEE Int. Symp. Radio-Frequency Integration Technology, 2022. (Invited)
  2. Te-Yen Chiu and Chun-Hsing Li, “A low-power 340-GHz receiver in 40-nm CMOS for THz imaging applications,” in IEEE Int. Symp. Radio-Frequency Integration Technology, 2021.
  3. Chun Wang and Chun-Hsing Li, “A G-band frequency doubler in 40-nm digital CMOS for THz applications,” in IEEE Int. Symp. Radio-Frequency Integration Technology, 2021.
  4. Te-Yen Chiu, Yu-Ling Lee, Chun-Lin Ko, Sheng-Hsiang Tseng, and Chun-Hsing Li, “A low-loss balun-embedded interconnect for THz heterogeneous system integration,” IEEE Int. Microwave Symp., 2020.
  5. Chun Wang, Kuang-Yu Chen, Yu-Ling Lee, and Chun-Hsing Li, “A X-/Ku-band QFN-packaged GaAs LNA supporting dual-polarization signal reception,” Asia-Pacific Microw. Conf. (APMC), 2019.
  6. Chun-Hsing Li and Te-Yen Chiu, “CMOS devices and circuits for THz applications,” Asia-Pacific Microw. Conf. (APMC), 2018. (Distinguished Invited Speaker)
  7. Yu-Lun Su, Chung-Chin Jian, Yu-Ling Lee, Chun-Hsing Li, and Thomas Lohrey, “Dichroic sub-reflector for wide band technique for single offset antenna,” EuMC, 2018.
  8. Chun-Hsing Li and Te-Yen Chiu, “A 340-GHz 2×2 CMOS THz imaging array sensor with high-resistivity silicon superstrate,” 6th Int. Sensors Science (I3S), 2018.
  9. Meng-Tse Hsu, Te-Yen Chiu, Syuan-Yu Wu, Yu-Ting Cheng, Chun-Hsing Li, and Chien-Nan Kuo, “A silicon-based parabolic sub-reflector antenna for gain enhancement and near-field focus applications,” IEEE Int. Conf. Micro Electro Mechanical Syst., 2018.
  10. Yen-Wei Chang, Ming-Che Yu, Hsien-Jia Lin, and Chun-Hsing Li, “Compact low-cost five-band RF energy harvester using system-in-packaging integration,” IEEE Radio Wireless Symposium, 2018. (Finalist of Best Student Paper)
  11. Te-Yen Chiu and Chun-Hsing Li, “A 340-GHz high-gain silicon dielectric resonator antenna for THz imaging applications,” The 28th VLSI/CAD Symposium, 2017. (Finalist of Best Student Paper)
  12. Te-Yen Chiu, Chun Wang, Wan-Ting Hsieh, Hsien-Jia Lin, Ta-Yeh Lin, Roger Liu, Da-Chiang Chang, and Chun-Hsing Li, “A 340-GHz high-gain flip-chip packaged dielectric resonator antenna for THz imaging applications,” in IEEE Int. Symp. Radio-Frequency Integration Technology, 2017. (Finalist of Best Student Paper)
  13. Chien-Nan Kuo, Wei-Cheng Chen, Te-Yen Chiu, and Chun-Hsing Li, “Enhancement of THz imaging sensing by packaging technology,” in IEEE Int. Symp. Radio-Frequency Integration Technology, 2017. (Invited)
  14. Yi-Xuan Lu, Meng-Tse Hsu, Yu-Ting Cheng, Chun-Hsing Li, and Chien-Nan Kuo, “Focused source formation using a micro disc-like patch antenna array for THz CMOS transmitter applications,” Transducers, 2017.
  15. Ming-Che Yu and Chun-Hsing Li, “High-sensitivity and high-efficiency 2.4-GHz RF energy harvester using SiP technique,” URSI Asia-Pacific Radio Science Conference, 2016.
  16. Te-Yen Chiu, Chun-Lin Ko, Chun-Hsing Li, Ming-Ching Kuo, and Da-Chiang Chang, “340-GHz signal source design with integrated on-chip bondwire antenna in 40-nm CMOS,” Int. Conf. Electronics Engineering Informatics, 2016.
  17. Chun-Hsing Li, Tzu-Chao Yan, Yuhsin Chang, Chyong Chen, and Chien-Nan Kuo, “Low-cost high-performance CMOS THz imaging system,” 12th Int. SOC Design Conference, 2015. (Invited)
  18. Wei-Min Wu, Ming-Che Yu, Chun-Hsing Li, and Chien-Nan Kuo, “A low-cost DC-to-92 GHz broadband three-path bondwire interconnect,” in IEEE Int. Symp. Radio-Frequency Integration Technology, 2015.
  19. Chun-Hsing Li, Chih-Wei Lai, Tzu-Chao Yan, and Chien-Nan Kuo, “A low-cost broadband bondwire interconnect for THz heterogeneous system integration,” in Proc. IEEE Int. Microwave Symp., 2015.
  20. Chun-Lin Ko, Chun-Hsing Li, Chien-Nan Kuo, Ming-Ching Kuo, and Da-Chiang Chang, “A 8-mW 77-GHz band CMOS LNA by using reduced simultaneous noise and impedance matching technique,” IEEE Int. Symp. Circuits Systems, 2015.
  21. Wei-Cheng Chen, Chih-Wei Lai, Tzu-Chao Yan, Chun-Hsing Li, Tzu-Yuan Chao, and Chien-Nan Kuo, “Electronic THz transmissive imaging systems,” IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, 2015.
  22. Tzu-Chao Yan, Chun-Hsing Li, Chih-Wei Lai, Wei-Cheng Chen, Tzu-Yuan Chao, and Chien-Nan Kuo, “CMOS THz transmissive imaging systems,” IEEE Asian Solid-State Circuits Conf., 2014.
  23. Chih-Wei Lai, Wei-Cheng Chen, Tzu-Chao Yan, Chun-Hsing Li, and Chien-Nan Kuo, “The experimental study of THz image sensor in 0.18 μm CMOS technology,” Asia-Pacific Microw. Conf., 2014.
  24. Tzu-Chao Yan, Chun-Hsing Li, Chih-Wei Lai, Wei-Cheng Chen, Tzu-Yuan Chao, and Chien-Nan Kuo, “THz imaging systems in CMOS technology,” The 25th VLSI/CAD Symposium, Aug. 2014.
  25. Chih-Wei Lai, Wei-Cheng Chen, Tzu-Chao Yan, Chun-Hsing Li, Ming-Ching Kuo, and Chien-Nan Kuo, “The experimental study of THz power detector design in 0.18-μm CMOS technology,” Progress in Electromagnetics Research Symposium, 2014.
  26. Chun-Hsing Li, Chih-Wei Lai, and Chien-Nan Kuo, “A 147 GHz fully differential D-band amplifier design in 65 nm CMOS,” Asia-Pacific Microw. Conf., 2013, pp. 691-693.
  27. Chun-Hsing Li, Jan-Jr Wu, Chien-Nan Kuo, Yu-Ting Cheng, and Ming-Ching Kuo, “A broadband interconnect for THz heterogeneous system integration,” IEEE Int. Microwave Symp., 2013, pp. 1-4.
  28. Chun-Hsing Li, Chun-Lin Ko, Chien-Nan Kuo, Ming-Ching Kuo, and Da-Chiang Chang, “A low-cost broadband bondwire interconnect for heterogeneous system integration,” IEEE Int. Microwave Symp., 2013, pp. 1-4.
  29. Chun-Hsing Li, Chien-Nan Kuo, and Ming-Ching Kuo, “A high Q on-chip bondwire transformer and its application to low power receiver front-end design,” IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, 2013, pp. 120-122.
  30. Chun-Hsing Li and Chien-Nan Kuo, “16.9-mW 33.7-dB gain mmWave receiver front-end in 65 nm CMOS,” IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, 2012, pp. 179-182.
  31. Chun-Hsing Li, Yen-Lin Liu, and Chien-Nan Kuo, “Theory of resonator coupling network and its application to receiver front-end design,” The 22th VLSI/CAD Symposium, Taiwan, Aug. 2011.
  32. Chun-Hsing Li, Chia-Yu Hsu, and Chien-Nan Kuo, “Low power 2.4 GHz receiver front-end using resonator coupling technique,” 54 th IEEE Int. Midwest Symp. Circuits Syst., 2011, pp.1-4. (Invited)
  33. Chun-Hsing Li and Chien-Nan Kuo, “Design optimization of a 1.4 GHz low power bulk-driven mixer,” Asia-Pacific Microw. Conf., 2010, pp. 1035-1038.
  34. Yen-Lin Liu, Chun-Hsing Li, and Chien-Nan Kuo, “Low voltage low power 5-GHz doubled balanced mixer with active phase shifter,” Asia-Pacific Microw. Conf., 2010, pp. 550-553.
  35. Chun-Hsing Li, Chang Tsung Fu, Tzu-Yuan Chao, Chien-Nan Kuo, Yu-Ting Cheng, and D.-C. Chang, “Broadband flip-chip interconnects for millimeter-wave Si-carrier system-on-package,” IEEE Int. Microwave Symp., 2007, pp. 1645-1648.
  36. Yang Chuan Chen, Chun-Hsing Li, J. K. Huang, Chien-Nan Kuo, and Yu-Ting Cheng, “Low power 3~8 GHz UWB tunable LNA design using SiP technology,” IEEE Int. Conf. Electronics Circuits Syst., 2006, pp. 1026-1029. (Best Paper Award)

 

Invited Talks

  1. Invited speaker, TAICS Standards Forum, Taiwan Association of Information and Communication Standards, 2022
  2. Keynote speech, 臺灣電信年會, 2021
  3. Invited speaker, TICD Seminar, Taiwan IC Design Society, 2021
  4. Invited speaker, IEEE CASIF in 6G Circuits and Systems, IEEE CASS Taipei Chapter & 科技部「應用於下世代通訊之240-GHz毫米波無線收發機關鍵電路研發計畫」, 2021
  5. Invited speaker, RichWave Technology Forum 立積電子技術高峰會, 2021
  6. Invited speaker, Seminar, Department of Electrical Engineering, National Taiwan Normal University, 2021
  7. Invited speaker, Seminar, Department of Electrical Engineering, National Yang Ming Chiao Tung University, 2021
  8. Invited speaker, 臺大系統晶片中心第四次研發季報「精準健康新興產業技術」, NTU SoC Center, 2020
  9. Invited speaker, Seminar, Department of Electrical Engineering, National Tsing Hua University, 2020
  10. Invited speaker, THz Workshop, National Tsing Hua University, 2019
  11. Distinguished Invited speaker, Asia Pacific Microwave Conference, 2018
  12. Invited speaker, Seminar, Department of Engineering and System Science, National Tsing Hua University, 2018.
  13. Invited speaker, Seminar, Department of Electrical Engineering, National Tsing Hua University, 2016.
  14. Invited speaker, Seminar, Department of Communications Engineering, Yuan-Ze University, 2014.
  15. Invited speaker, Seminar, Department of Electrical Engineering, National Central University, 2013.
  16. Invited speaker, Seminar, Department of Electrical Engineering, National Central University, 2014.

 

Patents Awarded

  1. 李俊興,郭建男,柯鈞琳,一種連接結構及其使用方法,中華民國專利,I511252。 (R.O.C. patent)
  2. 李俊興,郭建男,寬頻連接結構及其連接方法、傳輸裝置及傳輸寬頻訊號的方法,中華民國專利,I532351。 (R.O.C. patent)
  3. Chun-Hsing Li, Chien-Nan Kuo, and Chun-Lin Ko, “Interconnecting structure for electrically connecting a first electronic device and a second electronic device,” US9577308.
  4. Chun-Hsing Li and Chien-Nan Kuo, “Broadband connection structure and method,” US9450650.

Patent Pending

  1. 李俊興,邱品鈞,應用於無線系統的可延展相位陣列系統,中華民國專利,申請案號:111110064。 (R.O.C. patent)
  2. Chun-Hsing Li and Pin-Chun Chiu, “SCALABLE PHASED-ARRAY SYSTEM FOR WIRELESS SYSTEMS,” Application number: 17697918.